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PCBA Test

  • Description
Product Detail

    TYPE:

    PCBA test

    Test file

    Customer provided

    Max working panel area

    457*610MM

    Min boartd tinckness

    4 Layer:0.4MM/6 Layer:0.8MM/8 Layer:1.0MM/10 Layer:1.2MM

    Insulation resistance

    1E+12R(normal condition)

    Test type

    Available on request

    Casing material

    Metals/plastic/custom-made

    Business Type:

    Manufacturers

    Place of Origin

    Shenzhen,China

    Packing
    Standard export packing:
    1.Standard :antistatic bays ,vacuum package,customized package.
    2.Standard:K=K carton

    Delivery time: 3~5  days after receipt deposit

    Test service
    1.AOI Testing
    1.1Checks for solder paste
    1.2Check for components down to 0201
    1.3Check for missing components,polarity,offset,incorrect parts,short circuit,etc.
    2.X-Ray Inspection
    2.1Check BGA
    3 In-Circuit Testing
    3.1 power-up Test
    3.2Advanced Function Test
    3.3Functional testing
    Requested information for pcb assembly
    1.Gerber file of the bare pcb board
    2.BOM for assembly(bill of material)
    3.Testing Guide & Test file
    4.Programming files&programming file
    5.Schematic if necessary
    6.Clear Pic. Of PCB or PCBA sample if available
    ontract Printed Circuit Board (PCB) Assembly Services Specifications 

    Category

    Description

    Capability

    SMT Capability

    Qty of SMT Line

    5

    SMT Capacity

    35 Millions Per Day

    Max Board Size

    457mm × 610mm

    Min. Coponent Size

    0201

    BGA/µBGA 

    Available

    DIP Capability

    Qty of DIP Line

    3

    DIP Capacity

    0.2 Millions Per Day

    Max Board Width

    400 mm

    Lead-free Line

    Available

    Max. Degree

    399 °C

    Spray Flux Add-on

    Available

    Technical Data

    Stencil Size

    736mm × 736mm

    Min. IC Pitch

    0.3mm

    Max. IC Size

    50mm

    Max. PCB Size

    1200mm × 500mm

    Min. PCB Thickness

    0.35mm

    Min. Chip Size

    0201

    Max. BGA Size

    74mm × 74mm

    BGA Ball Pitch

    Min. : 1.0mm  Max. : 3.0mm

    BGA Ball Diameter

    Min. :  0.4 mm  Max. : 1.0mm

    OFP Lead Pitch

    Min. :  0.38 mm  Max. : 2.54mm

    Turn Times

    Quick turn are our specialty

    Assembly Type

    Surface Mount(SMT) Assembly

    Thru-Hole Assembly

    Mixed(Surface Mount and Thru-Hole)

    Cable Assembly

    Box Build Assembly

    Technical Data

    Stencil

    Laser Cut Stainless Steel

    Part Procurements

    Turnkey(We supply the Part)

    Consigned(You Supply the Parts)

    You Supply some part,we do the rest

Send your message to this supplier
To:  

Shenzhen Mingyangxing Electronics Co.,Ltd

* Content:  

For better quotations, include:

- A self introduction

- Special requests, if any

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