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PCB Assembly

  • Description
Product Detail

    TYPE:

    pcb assembly

    DIP service

    resistance/ capacitance/diode/transistor/ IC / IC socket.etc.

    SMT service

    0201/0402/0603/1206/particularity,etc

    Test type

    Available on request

    Casing material

    Metals/plastic/custom-made

    Business Type:

    Manufacturers

    Packing  
    Standard export packing:
    1.Standard :antistatic bays ,vacuum package,customized package.
    2.Standard:K=K carton

    Delivery time: 7-15 days after receipt deposit

    Order flow
    1.Check out:checkout and make payment for selected products
    2.Upload file:please compress the files into one zip-file and upload it
    3.Tech confirm: check every details for the files and communication
    4. System:track everything in on place
    5.shipping:please feel free to tell us do you like the experience or not
    OEM Services :
    Pcb assembly : SMT/RTH/Inspect
    Pcba and pcb design
    Components sourcing and purchasing
    Quick prototyping
    Plastic inection molding
    Metal sheet stamping/die casting
    Final assembly
    Test: AOI ,In-Circuit Test,Functional Test
    Requested information for pcb assembly
    1.Gerber file of the bare pcb board
    2.BOM for assembly(bill of material)
    3.Testing Guide & Test file
    4.Programming files&programming file
    5.Schematic if necessary
    6.Clear Pic. Of PCB or PCBA sample if available
    Contract Printed Circuit Board (PCB) Assembly Services Specifications 

    Category

    Description

    Capability

      SMT Capability

    Qty of SMT Line

    5

    SMT Capacity

    35 Millions Per Day

    Max Board Size

    457mm × 610mm

    Min. Coponent Size

    0201

    BGA/µBGA 

    Available

    DIP Capability

    Qty of DIP Line

    3

    DIP Capacity

    0.2 Millions Per Day

    Max Board Width

    400 mm

    Lead-free Line

    Available

    Max. Degree

    399 °C

    Spray Flux Add-on

    Available

    Technical Data

    Stencil Size

    736mm × 736mm

    Min. IC Pitch

    0.3mm

    Max. IC Size

    50mm

    Max. PCB Size

    1200mm × 500mm

    Min. PCB Thickness

    0.35mm

    Min. Chip Size

    0201

    Max. BGA Size

    74mm × 74mm

    BGA Ball Pitch

    Min. : 1.0mm  Max. : 3.0mm

    BGA Ball Diameter

    Min. :  0.4 mm  Max. : 1.0mm

    OFP Lead Pitch

    Min. :  0.38 mm  Max. : 2.54mm

    Turn Times

    Quick turn are our specialty

    Assembly Type

    Surface Mount(SMT) Assembly

    Thru-Hole Assembly

    Mixed(Surface Mount and Thru-Hole)

    Cable Assembly

    Box Build Assembly

    Technical Data

    Stencil

    Laser Cut Stainless Steel

    Part Procurements

    Turnkey(We supply the Part)

    Consigned(You Supply the Parts)

    You Supply some part,we do the rest

    Solder Type

    Leaded

    Lead-free/RoHS Compliant

    Other Capabilities

    Repair/Rework Service

    Mechanical Assembly

    Mould and Plastic Injection

    Material Sourcing

    Test and Inspection

    AOI Test

    X-Ray Inspection

    In-Circuit Test

    Solder Paste Insepct

    ATE Test

    Vibration Test

    Temp. & Humidity Test

    Function Test

    Certification

    ISO 9001 ,

Send your message to this supplier
To:  

Shenzhen Mingyangxing Electronics Co.,Ltd

* Content:  

For better quotations, include:

- A self introduction

- Special requests, if any

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